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Patent Searching and Data


Title:
RESIN COMPOSITION FOR MOLDING STRUCTURAL MATERIAL FOR ACOUSTIC APPLIANCE
Document Type and Number:
Japanese Patent JPS58104949
Kind Code:
A
Abstract:

PURPOSE: To prepare the titled composition giving a cured product having excellent acoustic effect such as high internal loss, etc., and suitable especially to speaker box, etc., by compounding a thermosetting resin with aromatic polyamide fibers, inorganic filler, and curing agent.

CONSTITUTION: The titled composition (100pts.wt.) is prepared by compounding and kneading (A) 17W40pts.wt. of a thermosetting resin (preferably a polyester resin, etc.), (B) a sufficient amount (50W80pts.wt.) of an inorganic filler having an average particle diameter of 0.2W100μ (e.g. calcium carbonate) to give a specific gravity of the cured resin composition of ≥1.8, (C) 3W15pts.wt. of aromatic polyamide fibers (filaments of 2W20mm length) as fibrous reinforcing material, and (D) a curing agent (e.g. peroxide).


Inventors:
KITAO NOBUHIDE
YAMAMOTO RIYOUTA
Application Number:
JP20478181A
Publication Date:
June 22, 1983
Filing Date:
December 18, 1981
Export Citation:
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Assignee:
NITTO ELECTRIC IND CO
International Classes:
G11B33/02; C08F2/00; C08F2/44; C08G85/00; C08L67/00; C08L67/06; C08L77/00; C08L101/00; H04R1/02; (IPC1-7): C08L77/00; C08L101/00; G11B1/00; H04R1/02
Attorney, Agent or Firm:
Takashima Hajime