Title:
RESIN COMPOSITION, MOLDING USING THE SAME, MULTILAYER STRUCTURE, AND INTERNAL CONTAINER FOR BAG-IN-BOX
Document Type and Number:
Japanese Patent JP2013018875
Kind Code:
A
Abstract:
To provide a resin composition which can obtain a molding etc. having high flexibility and excellent gas barrier property and transparency which EVHO originally has, and also has excellent melt moldability.
The resin composition contains (A) an ethylene-vinyl alcohol copolymer, (B) a thermoplastic resin having no polar group, and (C) a polyamide thermoplastic elastomer, wherein the mass ratio [(A)/((B)+(C))] of the (A) component to the total of the (B) component and the (C) component is 50/50 or more and 90/10 or less, and the mass ratio [(B)/(C)] of the component (B) to the component (C) is 50/50 or more and 99/1 or less.
Inventors:
HIROSE KO
Application Number:
JP2011153437A
Publication Date:
January 31, 2013
Filing Date:
July 12, 2011
Export Citation:
Assignee:
KURARAY CO
International Classes:
C08L29/02; B32B27/28; B65D30/02; B65D65/40; B65D77/06; B65D81/24; C08G69/40; C08L53/02; C08L77/00; C08L101/00
Domestic Patent References:
| JPH0691826A | 1994-04-05 | |||
| JPH06106688A | 1994-04-19 | |||
| JPH04372639A | 1992-12-25 | |||
| JPH06106686A | 1994-04-19 |
Attorney, Agent or Firm:
Hajime Amano
Fujimoto Katsune
Yu Okutani
Yoshinori Ikeda
Hiroshi Ogawa
Sanae Kato
Koji Ishida
Keiko Morita
Fujimoto Katsune
Yu Okutani
Yoshinori Ikeda
Hiroshi Ogawa
Sanae Kato
Koji Ishida
Keiko Morita
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