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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2020105332
Kind Code:
A
Abstract:
To provide a resin composition capable of forming a molding which achieves both a large phase difference and excellent heat resistance.SOLUTION: A resin composition contains a copolymer A containing an α-olefin-derived structural unit having 2 or more and 20 or less carbons and a cycloolefin-derived structural unit excluding norbornene, and a norbornene-based polymer B.SELECTED DRAWING: None

Inventors:
HARAUCHI YOSUKE
FUJII KENSAKU
Application Number:
JP2018244531A
Publication Date:
July 09, 2020
Filing Date:
December 27, 2018
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
C08L45/00; C08F232/04
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Yuta Terashima
Rintaro Takahashi