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Patent Searching and Data


Title:
RESIN COMPOSITION AND RESIN MOLDING
Document Type and Number:
Japanese Patent JPH1025403
Kind Code:
A
Abstract:

To obtain a resin compsn. which has both heavy and high grade feeling, enables even a complicate shape to be simply fabricated and can be molded into a resin molding having a grain-like appearance by adding a grain pattern material to a thermoplastic resin with a particular inorg. filler added thereto.

This resin compsn. comprises: a thermoplastic resin containing an inorg. filler selected from among barium sulfate, strontium sulfate, zinc oxide, and zinc sulfate; and a grain pattern material added to the thermoplastic resin. Grain pattern materials usable herein include cellulosic, thermosetting resins, and inorg. mixture materials. Preferred grain pattern materials include inorganic material mixture materials. This resin compsn. can be molded into a molded article having a grain-like appearance which is beautiful, has a feeling of high grade, and, when held in hands, gives weightiness unattainable by the conventional plastics and hence can be used as a high-grade interior article. Further, the resin compsn. can be subjected to injection molding, extrusion, heat compression molding or the like and can be applied to mass production of molded articles having a complicate shape.


Inventors:
MIZUKOSHI TOSHIO
Application Number:
JP20322296A
Publication Date:
January 27, 1998
Filing Date:
July 11, 1996
Export Citation:
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Assignee:
GE PLASTICS JAPAN LTD
International Classes:
C08J5/00; C08K3/00; C08K3/22; C08K3/28; C08K3/30; C08L67/00; C08L67/02; C08L101/00; (IPC1-7): C08L67/02; C08J5/00; C08K3/00; C08K3/22; C08K3/30; C08L101/00