Title:
RESIN COMPOSITION AND MULTILAYERED STRUCTURE
Document Type and Number:
Japanese Patent JPH03106953
Kind Code:
A
Abstract:
PURPOSE:To improve the thermal stability, melt moldability, and laminatability with rubber, and obtain a molded article excellent in the barrier properties by compounding a polyamide resin a saponificated ethylene-vinyl acetate copolymer, and a specific third component. CONSTITUTION:A resin compsn. is prepd. by compounding: a polyamide resin (A) pref. comprising nylon 11 and/or nylon 12; a saponificated ethylene-vinyl acetate copolymer (B) having an ethylene content of 20-65mol% and a saponification degree of the vinyl acetate part of 95mol% or higher in such an amt. that the ratio of A to B is (95:5)-(5:95); and a third component (C) selected from the group consisting of an arom. acid amide, an arom. acid ester, and an olefinic elastomer in such an amt. that (A+B)/C is 100/2-4.
Inventors:
TANAKA NOBUO
Application Number:
JP24464089A
Publication Date:
May 07, 1991
Filing Date:
September 19, 1989
Export Citation:
Assignee:
KURARAY CO
International Classes:
B32B27/28; B32B25/08; C08K5/10; C08K5/17; C08K5/20; C08L23/02; C08L23/16; C08L23/26; C08L29/04; C08L77/00; (IPC1-7): B32B27/28; C08K5/10; C08K5/20; C08L23/26; C08L29/04; C08L77/00
Domestic Patent References:
| JPS5836412A | 1983-03-03 |