Title:
RESIN COMPOSITION, ORGANIC FILM FORMED FROM THE COMPOSITION, AND ELECTRONIC COMPONENT USING THE ORGANIC FILM
Document Type and Number:
Japanese Patent JP2016035058
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition as an insulation film material, to which conventional printing technology can be applied to directly form a desired pattern, and which exhibits performances such as excellent adhesiveness to a substrate or an electrode, transparency, and chemical resistance.SOLUTION: A resin composition comprises: (1) a copolymer (A) having a weight average molecular weight Mw(a) of 10000 to 500000, which is a copolymer of a radical polymerizable monomer (a1) having a phenolic OH group and other radical polymerizable monomers (a2); (2) a copolymer (B) having a weight average molecular weight Mw(b) of less than 10000, which is a copolymer of a radical polymerizable monomer (b1) having a carboxyl group (-COOH) or a carboxylic acid anhydride group (-CO-O-CO-) and other radical polymerizable monomers (b2); and (3) an organic solvent. The weight average molecular weight Mw(a) of the copolymer (A) and the weight average molecular weight Mw(b) of the copolymer (B) satisfy an expression of 5≤Mw(a)/Mw(b)≤70.SELECTED DRAWING: None
Inventors:
KOBAYASHI YOSHITAKA
Application Number:
JP2015151426A
Publication Date:
March 17, 2016
Filing Date:
July 31, 2015
Export Citation:
Assignee:
JNC CORP
International Classes:
C08L101/06; C08F216/36; C08F246/00; C08L63/00; C09D11/106; C09D11/107; H01B3/36; H01B3/40; H01B3/44
Attorney, Agent or Firm:
Hiroshi Kobayashi
Norio Omori
Tsukasa Iguchi
Yasuhito Suzuki
Norio Omori
Tsukasa Iguchi
Yasuhito Suzuki
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