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Title:
RESIN COMPOSITION, PACKAGING FILM USING THE COMPOSITION, MULTILAYER FILM AND PACKAGING MATERIAL
Document Type and Number:
Japanese Patent JP2015044907
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a new resin composition capable of producing a new packaging film having sufficient moisture proofness, heat resistance and transparency and to provide a packaging film or the like using the new resin composition.SOLUTION: There is provided a resin composition which comprises an ethylene-based copolymer (A) composed of ethylene and hexene-1, a high pressure process ethylene homopolymer (B) and a crystal nucleating agent (C) and has a crystalline melting enthalpy of 120 to 160 J/j and a melt flow rate (MFR) of 1.5 to 3.0 g/10 min under the load of 2.16 kg at 190°C, wherein a packaging film or the like is constituted by using the resin composition.

Inventors:
TANAKA KAZUYA
NISHIDA RYOHEI
Application Number:
JP2013175739A
Publication Date:
March 12, 2015
Filing Date:
August 27, 2013
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC
International Classes:
C08L23/08; B32B27/32; B65D65/40; B65D81/24; C08J5/18; C08K3/00; C08K5/00; C08L23/06
Domestic Patent References:
JP2013036018A2013-02-21
JP2012172100A2012-09-10
JPH09272762A1997-10-21
JPH09169053A1997-06-30
JPS62122741A1987-06-04
JPH06329848A1994-11-29
JP2007308645A2007-11-29
JP2013159077A2013-08-19
Foreign References:
WO2013009514A12013-01-17
Attorney, Agent or Firm:
Yamamoto 典輝
Akihiko Yamashita
Kishimoto Expert