Title:
RESIN COMPOSITION, PERMANENT RESIST RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JPH11140145
Kind Code:
A
Abstract:
To provide a resin compsn. and a cured product thereof which can be easily developed, possess excellent solvent resistance and plating solution resistance, possess heat resistance high enough to withstand soldering temps., and are particularly suitable for permanent resists of printed wiring boards.
This resin compsn. and a cured product thereof comprise: an epoxy (meth)acrylate resin obtd. by reacting an epoxy resin represented by the formula (wherein (n) is an average value and is an no. of 0 or more) with a monocarboxylic acid contg. an unsatd. group; and a diluent.
Inventors:
YOKOSHIMA MINORU
OKUBO TETSUO
SASAHARA KAZUNORI
OKUBO TETSUO
SASAHARA KAZUNORI
Application Number:
JP32053897A
Publication Date:
May 25, 1999
Filing Date:
November 07, 1997
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
G03F7/027; C08F290/06; C08F299/02; C08G59/14; C08G59/17; C08L63/10; H05K3/18; H05K3/28; (IPC1-7): C08F290/06; C08F299/02; C08G59/14; C08G59/17; C08L63/10; G03F7/027; H05K3/18; H05K3/28