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Title:
RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2018172700
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat resistance and developing excellent sensitivity and high heat resistance in a well-balanced manner when prepared into a photosensitive resin composition.SOLUTION: The resin composition of the present invention comprises a phenolic resin and a polymer including a repeating unit represented by formula (1) below. In formula (1), Rand Reach independently represent hydrogen or an organic group having 1 to 3 carbon atoms.SELECTED DRAWING: Figure 1

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Inventors:
穴田 亘平
大西 治
Application Number:
JP2018146540A
Publication Date:
November 08, 2018
Filing Date:
August 03, 2018
Export Citation:
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Assignee:
住友ベークライト株式会社
International Classes:
C08L61/06; C08F222/06; C08F222/40; C08F232/00; C08G8/34; C08L35/00; C08L45/00; G03F7/023
Domestic Patent References:
JPH04277751A1992-10-02
JP2005105209A2005-04-21
JPH06305076A1994-11-01
Attorney, Agent or Firm:
速水 進治