Title:
樹脂組成物、感光性フィルム、支持体付き感光性フィルム、プリント配線板及び半導体装置
Document Type and Number:
Japanese Patent JP7281263
Kind Code:
B2
Abstract:
The present invention relates to a photosensitive resin composition capable of obtaining a cured product excellent in undercut resistance and, more specifically, to a resin composition comprising: (A) a resin containing an ethylenically unsaturated group and a carboxyl group; (B) an inorganic filler having an average particle diameter of 0.5 [mu]m or more; (C) an epoxy resin; and (D) a photopolymerization initiator, wherein the (A) component contains (A-1) a naphthalene skeleton-containing resin.
Inventors:
Yuki Karakawa
Application Number:
JP2018182665A
Publication Date:
May 25, 2023
Filing Date:
September 27, 2018
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
G03F7/027; C08F290/00; C08G59/18; G03F7/004; H05K1/03; H05K3/28
Domestic Patent References:
| JP2013214057A | ||||
| JP2017120395A | ||||
| JP201592228A | ||||
| JP20157759A | ||||
| JP2017107182A | ||||
| JP201564546A | ||||
| JP2016147945A | ||||
| JP200524659A | ||||
| JP2001278947A |
Foreign References:
| WO2017159381A1 | ||||
| WO2011089987A1 | ||||
| WO2013172433A1 | ||||
| WO2018143220A1 |
Attorney, Agent or Firm:
Sakai International Patent Office