Title:
RESIN COMPOSITION FOR PLATING, PLATING METHOD OF MOLDED PRODUCT, AND PLATED MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP3052038
Kind Code:
B2
Abstract:
PURPOSE: To obtain the composition capable of forming molded products having an excellent shielding effect for electromagnetic waves, and having high adhesion to the plating.
CONSTITUTION: A resin composition for plating characterized by containing 100wt.pt. of a thermoplastic resin and 0.1-15wt.pt. of a cationic surfactant. A method of plating a molded product by plating a molded product of a thermoplastic resin composition obtained by combining 0.1-15wt.pt. of a cationic surfactant to 100wt.pt. of a thermoplastic resin in a resin composition containing a thermoplastic resin.
Inventors:
Yoshiaki Miura
Takeo Hashimoto
Takeo Hashimoto
Application Number:
JP13890594A
Publication Date:
June 12, 2000
Filing Date:
June 21, 1994
Export Citation:
Assignee:
Idemitsu Petrochemical Co., Ltd.
International Classes:
C08K3/00; C08K5/00; C08K5/16; C08K5/17; C08L23/00; C08L25/04; C08L69/00; C08L101/00; C08L101/16; C23C18/16; (IPC1-7): C08L101/16; C08K5/17; C08L23/00; C08L25/04; C08L69/00; C23C18/16
Domestic Patent References:
| JP5582138A | ||||
| JP5817159A |
Attorney, Agent or Firm:
Masamichi Higashihira