To provide a resin composition having low dielectric dissipation factor and high surface smoothness; and a metal laminate using the resin composition.
The resin composition includes: (a) an aromatic polyimide prepared by reacting a diamine compound including an aromatic diamine compound with a tetracarboxylic dianhydride including an aromatic tetracarboxylic dianhydride; and (b) a cage type silsesquioxane partial cleavage structure having a silanol group and a phenyl group and having a dielectric loss tangent lower than that of the aromatic polyimide (a). In the aromatic polyimide, a ratio of the total of the aromatic diamine compound and the aromatic tetracarboxylic dianhydride to the total of the diamine compound and the tetracarboxylic dianhydride is ≥70 mol%, and when two or more aromatic rings are connected mutually in the molecule in the aromatic diamine compound or the aromatic tetracarboxylic dianhydride, aromatic rings are connected mutually via a single bond.
TORIIDA MASAHIRO
TAKAGI TOSHIHIKO
TAMAI MASAJI
HE CHAO-BIN
MYA KHINE YI
YANG SHAO
LI XU
AGENCY SCIENCE TECH & RES
Kazuto Iinuma
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