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Title:
RESIN COMPOSITION, PREPREG AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2003041094
Kind Code:
A
Abstract:

To provide a resin composition having excellent dielectric properties and high flame retardancy, and prepregs and circuit boards.

The resin composition comprises a cyanate resin, an aralkyl- modified epoxy resin, an aralkyl resin and a flame retardant. The prepreg is given by impregnating a base material with the resin composition. Further, the circuit boards are produced by laminating one or two or more of the prepregs and pressing them with heat.


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Inventors:
TOBISAWA AKIHIKO
Application Number:
JP2001228603A
Publication Date:
February 13, 2003
Filing Date:
July 27, 2001
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08J5/24; C08K5/49; C08L63/00; C08L65/00; C08L79/00; H05K1/03; (IPC1-7): C08L63/00; C08J5/24; C08K5/49; C08L65/00; C08L79/00; H05K1/03
Domestic Patent References:
JP2003073543A2003-03-12
JP2002206048A2002-07-26
JP2000129089A2000-05-09
JP2000313737A2000-11-14
JP2001172473A2001-06-26
JP2000336243A2000-12-05
JP2001049080A2001-02-20
JP2000129090A2000-05-09
JP2000186186A2000-07-04
JP2003073543A2003-03-12
JP2002206048A2002-07-26
JP2000129089A2000-05-09
JP2000313737A2000-11-14
Attorney, Agent or Firm:
Tatsuya Masuda (1 outside)



 
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