Title:
RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR PRODUCING RESIN COMPOSITION, AND PREPOLYMER FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2021187888
Kind Code:
A
Abstract:
To provide a resin composition which is excellent in storage stability and can exhibit excellent dielectric characteristics at a high frequency band of 10 GHz band or more, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, and a method for producing a resin composition and a prepolymer for a printed wiring board.SOLUTION: There are provided a resin composition that contains a prepolymer (A) obtained by homopolymerization of a maleimide compound (a) having two or more N-substituted maleimide groups in the presence of a polymerization accelerator (b), or polymerization of the component (a) and an amine compound (c) having two or more primary amino groups in the presence of the polymerization accelerator (b). An amount of a primary amino group of the component (c) in the polymerization is 0.15 or less with respect to an amount of the N-substituted maleimide group of the component (a) in a molar ratio; a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition; and a method for producing a resin composition and a prepolymer for a printed wiring board.SELECTED DRAWING: None
Inventors:
TAKI TAKAHIRO
EJIRI TAKAKO
FUJII TOSHIKI
OMORI YUKAKO
EJIRI TAKAKO
FUJII TOSHIKI
OMORI YUKAKO
Application Number:
JP2020091531A
Publication Date:
December 13, 2021
Filing Date:
May 26, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
C08L79/00; B32B15/08; B32B27/18; B32B27/20; C08K3/013; C08K3/016; C08L53/02; C08L71/12; H05K1/03
Attorney, Agent or Firm:
Otani patent office