Title:
RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2014084327
Kind Code:
A
Abstract:
To provide a resin composition for a printed wiring board material, a prepreg, a laminate, and a metal-clad laminate which maintain high flame retardancy without using a halogenated compound and a phosphorus compound, has high heat resistance, has a low thermal expansion coefficient in the surface direction, and has excellent drilling workability.
A resin composition contains: a hydroxyl group- containing silicone compound (A); a cyanic acid ester compound (B) and/or a phenol resin (C); and an inorganic filler (D).
Inventors:
CHIBA YU
TAKAHASHI HIROSHI
SHIGA EISUKE
KOGASHIWA TAKAAKI
TAKAHASHI HIROSHI
SHIGA EISUKE
KOGASHIWA TAKAAKI
Application Number:
JP2012231634A
Publication Date:
May 12, 2014
Filing Date:
October 19, 2012
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L83/06; B32B17/04; C08G59/40; C08J5/24; C08K3/00; C08K5/3415; C08K5/3472; C08L61/06; C08L63/00; C08L65/00; C08L79/04; H05K1/03
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