Title:
RESIN COMPOSITION, PREPREG AND LAMINATE USING IT
Document Type and Number:
Japanese Patent JP2003020327
Kind Code:
A
Abstract:
To provide a resin composition having low dielectric constant and low water absorption, a prepreg and a laminate.
The resin composition comprises (A1) an epoxy resin having a dicyclopentadiene skeleton and (B) a polybutadiene-modified phenolic resin. The prepreg is produced by impregnating a substrate with the resin composition. The laminate is produced by laying one or more plies of the prepreg one upon another and hot-pressing them.
Inventors:
EKUSA SHIGERU
TOBISAWA AKIHIKO
URATA YOSHITERU
TOBISAWA AKIHIKO
URATA YOSHITERU
Application Number:
JP2001208785A
Publication Date:
January 24, 2003
Filing Date:
July 10, 2001
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08J5/24; C08G59/62; (IPC1-7): C08G59/62; C08J5/24