樹脂組成物、プリプレグ、積層板及びプリント基板

Title:

樹脂組成物、プリプレグ、積層板及びプリント基板

Document Type and Number:

Japanese Patent JP5093059

Kind Code:

B2

Abstract:

To provide a material for a high frequency-capable wiring board that satisfies all of adhesion, low thermal expansion, low dielectric loss, low conductor loss and processability, to provide a multilayer printed board using the material and to provide an electronic component.

A resin composition including 70-90 pts.wt. crosslinking component, 10-30 pts.wt. high molecular weight component having an elongation at break of 700% or more and 150-400 pts.wt. inorganic filler is used in an insulating layer.

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Inventors:

Satoru Amaha
Hiroshi Shimizu
Hanaki Myotoku
Nunoju
Yano Masafumi

Application Number:

JP2008285076A

Publication Date:

December 05, 2012

Filing Date:

November 06, 2008

Export Citation:

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Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C08L101/00; B32B15/08; C08F283/00; C08F290/06; C08F299/02; C08J5/24; C08K3/00; C08K5/03; C08K9/04; H05K1/03

Domestic Patent References:

JP2060948A
JP7247414A
JP2000226509A
JP2001102759A
JP2005089691A
JP2005105061A

Attorney, Agent or Firm:

Polaire Patent Business Corporation

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