Title:
RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2018035257
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining an insulating layer which is excellent in workability and satisfies dielectric characteristics and solder heat resistance in a high frequency region required for an insulating layer for electronic components such as a printed wiring board.SOLUTION: A resin composition contains a cyclic olefin copolymer (A) having a glass transition temperature of 150°C or higher and lower than 250°C, and a crosslinking agent (B). A ratio ((A)/(B)) of a content of the cyclic olefin copolymer (A) to a content of the crosslinking agent (B) in the resin composition is 10 or more and 200 or less.SELECTED DRAWING: None
Inventors:
MURASE HIROHIKO
MORITA ATSUSHI
OIKAWA TAKASHI
SAITO JUNJI
MORITA ATSUSHI
OIKAWA TAKASHI
SAITO JUNJI
Application Number:
JP2016169452A
Publication Date:
March 08, 2018
Filing Date:
August 31, 2016
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L45/00; B32B15/08; C08F232/00; C08J5/24; C08K5/00; H05K1/03
Domestic Patent References:
| JP2016017089A | 2016-02-01 |
Foreign References:
| WO2012046443A1 | 2012-04-12 |
Attorney, Agent or Firm:
Shinji Hayami