Title:
樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP6732215
Kind Code:
B2
Abstract:
It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in chemical resistance, desmear resistance, and insulation reliability. The resin composition of the present invention contains a maleimide compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
Inventors:
Tomizawa Katsuya
Yoichi Takano
Tamaki Ito
Eisuke Shiga
Yoichi Takano
Tamaki Ito
Eisuke Shiga
Application Number:
JP2017527444A
Publication Date:
July 29, 2020
Filing Date:
July 04, 2016
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08L79/04; C08F2/44; C08J5/24; C08J7/043; C08K3/00; C08K3/013; C08K5/29; C08K5/3415; C08K5/3442; C08K5/541; C08L35/00; C08L57/00; H05K1/03
Domestic Patent References:
| JP2008133414A | ||||
| JP2008291227A | ||||
| JP2012197336A | ||||
| JP56045948A |
Foreign References:
| WO2013047041A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito