Title:
樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP6760281
Kind Code:
B2
Abstract:
It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
Inventors:
Tomizawa Katsuya
Yoichi Takano
Tamaki Ito
Eisuke Shiga
Yoichi Takano
Tamaki Ito
Eisuke Shiga
Application Number:
JP2017527445A
Publication Date:
September 23, 2020
Filing Date:
July 04, 2016
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08G73/00; B32B15/088; B32B15/092; B32B27/00; B32B27/20; B32B27/34; B32B27/38; C08J5/24; C08K5/54; C08L35/00; C08L79/00; H05K1/03
Domestic Patent References:
| JP2011530618A | ||||
| JP2006124425A | ||||
| JP10292033A | ||||
| JP2014185222A |
Foreign References:
| WO2015060266A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito