Title:
RESIN COMPOSITION, PREPREG USING THE SAME, FLAME-RETARDANT LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2007051267
Kind Code:
A
Abstract:
To obtain a resin composition, prepreg, a flame-retardant laminate that has high heat resistance, excellent copper foil peel strength, resistance to electrolytic corrosion and drill processability and a printed wiring board that deals with Pb-free solder and has high reliability.
The resin composition comprising ≤0.2 wt.% of particles having ≤0.5μm particle diameter as an inorganic filler and aluminum hydroxide having ≤1.5 cm2/g BET specific surface area and 1.0-5.0μm average particle diameter in the resin composition.
Inventors:
OSE MASAHISA
SHIMAOKA SHINJI
MIYATAKE MASATO
KATO AKIRA
SHIMAOKA SHINJI
MIYATAKE MASATO
KATO AKIRA
Application Number:
JP2006035088A
Publication Date:
March 01, 2007
Filing Date:
February 13, 2006
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L87/00; B32B15/08; C08J5/24; C08K3/22; C08K3/36; H05K1/03
Domestic Patent References:
| JP2002187937A | 2002-07-05 | |||
| JP2005239760A | 2005-09-08 | |||
| JP2004175895A | 2004-06-24 | |||
| JP2002212397A | 2002-07-31 | |||
| JP2006124420A | 2006-05-18 | |||
| JP2006199565A | 2006-08-03 |