Title:
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD PREPARED THEREFROM, AND PREPARATION OF THE BOARD
Document Type and Number:
Japanese Patent JPH03273063
Kind Code:
A
Abstract:
PURPOSE:To prepare the title compsn. excellent in heat resistance by compounding more than one specific materials as fillers into a thermoset resin compsn. not contg. a rubber resin. CONSTITUTION:A thermoset resin compsn. not contg. a rubber resin (e.g. an o-cresol epoxy resin is compounded with a cellulose powder and calcium carbonate as fillers.
Inventors:
TAGAMI YOSHITAKA
KOBAYASHI NAOMI
YOSHIDA AKIMITSU
KOBAYASHI NAOMI
YOSHIDA AKIMITSU
Application Number:
JP7263690A
Publication Date:
December 04, 1991
Filing Date:
March 22, 1990
Export Citation:
Assignee:
SHIN KOBE ELECTRIC MACHINERY
International Classes:
C08K3/36; C08L1/00; C08L101/00; H05K1/03; (IPC1-7): C08K3/36; C08L1/00; C08L101/00; H05K1/03
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