To obtain a nonhalogen printed wiring board having a high Tg and an excellent solder heat resistance at a high temperature.
The resin composition for a printed wiring board comprises an epoxy resin, a curing agent and a flame retardant imparting agent. (a) The epoxy resin comprises an epoxy resin containing a biphenyl skeleton and a cresol novolac type epoxy resin and the ratio of the epoxy resin containing the biphenyl skeleton is 40-60 wt.% in the epoxy resins. (b) The curing agent is a phenol resin containing a nitrogen atom in the molecular structure. (c) The flame retardant imparting agent comprises a phosphorus compound containing ≥8% and ≤25% phosphorus atom content. The composition has the ratio of the hydroxy group of (b)/the epoxy group of (a) of 0.4-0.8.
OHASHI KENICHI
AITSU SHUJI
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Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu