Title:
RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN VARNISH USING THE SAME, PREPREG, AND METAL-CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2010280893
Kind Code:
A
Abstract:
To provide a thermosetting resin composition for a printed wiring board excellent in dielectric characteristics, low hygroscopicity, thermal expansion characteristics, adhesion to metal foil, and moldability, a resin varnish using the same, a prepreg, and a metal-clad laminate.
The resin composition comprises as components: (A) a chemically non-modified butadiene polymer containing 40% or more, in a molecule, of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; (B) a maleimide compound; or a prepolymer of the component (A) and the component (B). The component (B) is a compound represented by formula (2), wherein R2 is -C(Xc)2- or -O-, p is an integer of 0-10, and q is an integer of 2-10.
Inventors:
MIZUNO YASUYUKI
FUJIMOTO DAISUKE
DANSEIGEN KAZUTOSHI
MURAI AKIRA
FUJIMOTO DAISUKE
DANSEIGEN KAZUTOSHI
MURAI AKIRA
Application Number:
JP2010172004A
Publication Date:
December 16, 2010
Filing Date:
July 30, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L47/00; C08J5/24; C08K5/3415; H05K1/03
Domestic Patent References:
| JPH0289386A | 1990-03-29 | |||
| JP2000290433A | 2000-10-17 | |||
| JP2008095061A | 2008-04-24 | |||
| JPH06192478A | 1994-07-12 | |||
| JPH08245833A | 1996-09-24 |
Foreign References:
| WO2007094359A1 | 2007-08-23 |
Attorney, Agent or Firm:
Hajime Tsukuni
Fusayuki Saito
Satoko Ito
Fusayuki Saito
Satoko Ito