RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME

Japanese Patent JP2005068414

A

To provide a resin composition excellent in barrier properties, flexibility, fabrication processability and interlaminar bondability and to provide a process for producing the resin composition that takes the environment into consideration so as not to discharge carboxylic acids such as acetic acid or the like to ambient environment.

The resin composition is an EVOH resin composition (F) which has a content of an alkali metal salt (A) of 0.1-20 μmol/g in terms of the alkali metal, a content of a carboxylic acid or a salt thereof (C) of 2 μmol/g or less in terms of the carboxylic acid group, an ethylene content of 5-60 mol% and a saponification degree of 80-99 mol%. Additionally, the resin composition is a resin composition which comprises the EVOH resin composition (F) and an EVOH having an ethylene content of 5-60 mol% and a saponification degree of 99.2-100 mol%.

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NAKANO KENJI
UCHIUMI NAOHIKO
IKEDA KAORU

JP2004223789A

March 17, 2005

July 30, 2004

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KURARAY CO

B65D1/00; B32B27/28; B65D1/09; B65D65/02; B65D65/40; C08J3/205; C08K3/18; C08K3/32; C08L29/04; (IPC1-7): C08L29/04; B32B27/28; B65D1/09; B65D65/02; B65D65/40; C08J3/205; C08K3/18; C08K3/32

JP2001164070A	2001-06-19
JP2001164059A	2001-06-19
JP2001146539A	2001-05-29
JP2001072823A	2001-03-21
JP2000281715A	2000-10-10
JPS6323950A	1988-02-01

Hirosaburo Mori
Toshio Mori
Shigeki Nakatsugu
Takaaki Funabuchi

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