Title:
RESIN COMPOSITION FOR REFLOW AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3048727
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition improved in heat resistance and reliability in soldering by mixing a specified aromatic polyester with a fibrous reinforcement.
CONSTITUTION: Diphenyl isophthalate, hydroquinone and 4,4'-dihydroxydiphenyl are polycondensed at 150-300°C in the presence of a catalyst in an inert gas atmosphere to obtain an aromatic polyester comprising components of formulas I, II and III and having an equivalent ratio of the component (II) to the component (III) of 60/40 to 90/10 and an intrinsic viscosity of 0.3-1.5 as measured in a P-chlorophenol/tetrachloroethane solvent (weight ratio 60/40) at 35°C. 95-30wt.% this polyester is mixed with 5-70wt.% fibrous reinforcement of an aspect ratio of 10 or above.
Inventors:
Shunichi Matsumura
Nobuaki Kido
Hiroo Inada
Nobuaki Kido
Hiroo Inada
Application Number:
JP1008792A
Publication Date:
June 05, 2000
Filing Date:
January 23, 1992
Export Citation:
Assignee:
Teijin Limited
International Classes:
C08L67/00; C08L67/02; C08L67/03; H01L23/29; C08K7/02; H01L23/31; (IPC1-7): C08L67/03; C08K7/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP328221A |
Attorney, Agent or Firm:
Sumihiro Maeda