樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法

Title:

樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法

Document Type and Number:

Japanese Patent JP7137950

Kind Code:

B2

Abstract:

To provide a resin composition having low dielectric loss tangent, high adhesiveness with a copper layer, and a heat resistance, and including a silica filler capable of suppressing deterioration progress of a continuously used melanism treatment liquid.SOLUTION: There is provided a resin composition containing an elastomer, a polyarylene ether compound, a phosphorous compound represented by the following formula (I): where n is 3 or 4, a silica particle, and a silane coupling agent, and having content of the silane coupling agent satisfying a relation of 0.0900≤x/S≤0.4000, wherein x is weight percentage of the silane coupling agent based on weight of the silica particle, and S (m/g) is BET specific area of the silica particle.SELECTED DRAWING: None

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Inventors:

Kazuhiro Osawa
Kuniharu Ogawa
Haruka Makino

Application Number:

JP2018062270A

Publication Date:

September 15, 2022

Filing Date:

March 28, 2018

Export Citation:

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Assignee:

Mitsui Mining & Smelting Co., Ltd.

International Classes:

C08L25/02; B32B15/08; C08K3/36; C08K5/5399; C08L71/12; H05K1/03

Domestic Patent References:

JP2007262191A
JP2008248001A
JP2007224162A
JP2010138364A

Foreign References:

WO2012128313A1

Attorney, Agent or Firm:

Masaharu Takamura
Yu Hasegawa
Ryo Kawachi

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