Title:
樹脂組成物及び樹脂成形体
Document Type and Number:
Japanese Patent JP7053199
Kind Code:
B2
Abstract:
To provide a resin composition achieving both of excellent thin wall moldability and high rigidity at the same time, having high thermal stability during molding as well.SOLUTION: A resin composition comprises 100 pts.mass of polyacetal resin (A) and 10 pts.mass or more and 55 pts.mass or less of glass fiber (B). The polyacetal resin (A) has a comonomer content of 0.001 mol% or more and 1.2 mol% or less, and a melt flow rate (in accordance with ISO1133, temperature: 190°C, load: 2.16 kg) of 8 g/10 min or more and 30 g/10 min or less.SELECTED DRAWING: None
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Inventors:
Yousuke Takahashi
Yasukazu Kano
Yasukazu Kano
Application Number:
JP2017175773A
Publication Date:
April 12, 2022
Filing Date:
September 13, 2017
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08L59/00; B29C45/00; C08G2/00; C08K5/098; C08K7/14
Domestic Patent References:
| JP2006299107A | ||||
| JP4266917A | ||||
| JP2016089033A | ||||
| JP10237268A |
Foreign References:
| WO2001032775A1 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koichiro Kami
Koji Kakinuma
Mitsutsugu Sugimura
Koichiro Kami
Koji Kakinuma