Title:
樹脂組成物及び樹脂成形体
Document Type and Number:
Japanese Patent JP7057113
Kind Code:
B2
Abstract:
The present invention relates to a resin composition and a resin molded body, particularly a resin composition and a molded body which simultaneously satisfy excellent thin wall moldability and high slidability, and more particularly a resin composition comprising, by mass, 100 parts of (A) polyacetal resin, 10 parts or more and 55 parts or below of (B) glass fibers, and 0.1 parts or more and 5 parts or below of (C) polyethylene resin; and a resin molded body characterized by comprising the resin composition, wherein the melt flow rate (measured according to ISO1133 at 190 DEG C with a load of2.16 kg) of the (C) polyethylene resin is 10g/10 min or above and 100g/10 min or below; and a ratio of the melt flow rate (measured according to ISO1133 at 190 DEG C with a load of 2.16 kg) of the (A) polyacetal resin to the melt flow rate of the (C) polyethylene resin is 0.1 or above and 2.0 or below.
Inventors:
Yousuke Takahashi
Yasukazu Kano
Yasukazu Kano
Application Number:
JP2017236161A
Publication Date:
April 19, 2022
Filing Date:
December 08, 2017
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08G2/10; C08L59/00; C08J5/18; C08K7/14; C08L23/06
Domestic Patent References:
| JP10237268A | ||||
| JP2017062017A | ||||
| JP2017061644A | ||||
| JP2016089033A | ||||
| JP2017002227A | ||||
| JP2017061650A |
Foreign References:
| WO2014021413A1 | ||||
| US5237008 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koichiro Kami
Mitsutsugu Sugimura
Koichiro Kami
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