Title:
樹脂組成物、樹脂シート、多層プリント配線板、及び半導体装置
Document Type and Number:
Japanese Patent JP7298798
Kind Code:
B2
Abstract:
Provided are: a resin composition that, when being used for manufacturing a multilayer printed wiring board, does not inhibit a light curing reaction in an exposure step and that can provide excellent alkali developing ability in a development step; a resin sheet; a multilayer printed wiring board; and a semiconductor device. The resin composition according to the present invention contains a compound (A) represented by formula (1), and a compound (B) that is other than the compound (A) represented by formula (1) and that includes at least one carboxy group. (In formula (1), each R1 independently represents a hydrogen atom or a group represented by formula (2). Each R2 independently represents a hydrogen atom or a linear or branched alkyl group having 1-6 carbon atoms. However, at least one R1 is a group represented by formula (2)). (In formula (2), -* indicates a bond.)
Inventors:
Yune Kumazawa
Shunsuke Katagiri
Takuya Suzuki
Shunsuke Katagiri
Takuya Suzuki
Application Number:
JP2023508068A
Publication Date:
June 27, 2023
Filing Date:
June 14, 2022
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08F22/40; H05K1/03
Domestic Patent References:
| JP2014234500A | ||||
| JP2017039894A | ||||
| JP2015229734A |
Foreign References:
| WO2020262579A1 | ||||
| WO2021117760A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito