Title:
RESIN COMPOSITION FOR SEALER
Document Type and Number:
Japanese Patent JP3210490
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition having excellent alkali barrier effect and adhesivity, low in problems of air pollution and environmental hygiene by conterining a copolymer of a specific composition in an aliphatic hydrocarbon-based solvent or an alicyclic hydrocarbon-based solvent.
CONSTITUTION: This resin composition comprises a copolymer obtained by copolymerizing 100wt.% total (B) of (i) 15-60wt.% of an alkyl acrylate or alkyl (meth)acrylate having 6-18C alkyl (preferably 2-ethylhexyl acrylate), (ii) 30-85wt.% of a vinyl-based monomer of the formula (R1 is H or CH3; (x) is H, a 1-2C alkyl, etc.; R2 is a 1-12C straight-chain or branched alkyl) (preferably styrene) and (iii) a monomer except the components (i) and (II) in (A) an organic solvent consisting mainly of an aliphatic hydrocarbon-based solvent or an alicyclic hydrocarbon-based solvent (preferably n-hexane) in the ratio of 30-1,200 pts.wt. of the component A based on 100 pts.wt. of the component B.
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Inventors:
Takao Fujii
Hiroaki Obata
Hiroshi Serizawa
Hiroaki Obata
Hiroshi Serizawa
Application Number:
JP15894293A
Publication Date:
September 17, 2001
Filing Date:
June 29, 1993
Export Citation:
Assignee:
Nippon Carbide Industry Co., Ltd.
International Classes:
C08L23/08; C08L23/00; C08L25/00; C08L25/04; C08L27/06; C08L31/02; C08L31/04; C08L33/04; C08L33/08; C09D5/34; C09D123/02; C09D123/08; C09D125/00; C09D125/04; C09D127/04; C09D127/06; C09D131/02; C09D131/04; C09D133/04; C09D133/08; C09K3/10; (IPC1-7): C08L33/08; C08L23/08; C08L25/04; C08L27/06; C08L31/02; C09D5/34; C09D123/08; C09D125/04; C09D127/06; C09D131/02; C09D133/08; C09K3/10
Domestic Patent References:
JP288608A | ||||
JP60166354A |
Attorney, Agent or Firm:
Osamu Hatori