Title:
RESIN COMPOSITION FOR SEALING OR BONDING
Document Type and Number:
Japanese Patent JP3418432
Kind Code:
B2
Abstract:
PURPOSE: To obtain a resin composition for sealing or bonding having an excellent low water absorbing property, low moisture permeability, and electric characteristics by mixing a specific amount of inorganic filler in an amorphous fluororesin.
CONSTITUTION: A resin composition composed of an amorphous fluororesin A, inorganic filler B, and organic solvent C so that B/A+B can become 20-90wt.%. The fluororesin A is composed of a polymer having the a fluorine- containing alicyclic structure having excellent mechanical characteristics. The addition of the inorganic filler contributes to the reduction of the moisture permeability of the fluororesin. When a coupling agent is added as necessary, the wettability and adhesion between the fluororesin and filler can be improved and the water absorbing property of the resin composition is reduced. Therefore, a resin composition for sealing and bonding electronic and electric parts having an excellent low water absorbing property, low moisture permeability, and electric characteristics can be obtained.
Inventors:
Shunsuke Yokotsuka
Kou Aozaki
Masaki Narutomi
Atsuo Hiroi
Kou Aozaki
Masaki Narutomi
Atsuo Hiroi
Application Number:
JP23567193A
Publication Date:
June 23, 2003
Filing Date:
August 27, 1993
Export Citation:
Assignee:
Asahi Glass Co., Ltd.
Asahi Techno Glass Co., Ltd.
Asahi Techno Glass Co., Ltd.
International Classes:
C09J127/12; H01L23/10; H01L23/29; H01L23/31; (IPC1-7): H01L23/10; H01L23/29; H01L23/31
Domestic Patent References:
| JP2212541A | ||||
| JP64142024A |
Attorney, Agent or Firm:
Mamoru Tsunoda