Title:
RESIN COMPOSITION FOR SEALING ELECTRIC AND ELECTRONIC ELEMENTS
Document Type and Number:
Japanese Patent JP3893422
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a sealing resin, especially a sealing resin suitable for liquid sealing remarkably improving reliability of semiconductors through enhancing its moisture resistance and effectively protecting the semiconductors from infiltration of, e.g. water from the outside.
SOLUTION: This resin composition for sealing electric and electronic elements comprises (A) an epoxidized liquid polybutadiene having an epoxy equivalent of 100 to 3,000 and a viscosity of 5 to 2,500 poise at 25°C, obtained by epoxidizing a liquid polybutadiene having a vinyl group content of ≤2%, a 1,4-cis form content of 70 to 90%, a 1-4 trans form content of 10 to 30% and a number-average molecular weight of 500 to 4,500 and (B) a curing agent, as the essential components.
Inventors:
Koichi Ohashi
Satoshi Mori
Satoshi Mori
Application Number:
JP28125597A
Publication Date:
March 14, 2007
Filing Date:
September 29, 1997
Export Citation:
Assignee:
Shin Nippon Oil Co., Ltd.
International Classes:
C08G59/34; C08L63/08; C08F8/08; H01L23/29; H01L23/31; (IPC1-7): C08L63/08; C08G59/34; H01L23/29; H01L23/31
Domestic Patent References:
| JP62081446A | ||||
| JP59117524A | ||||
| JP49004737A | ||||
| JP61136514A | ||||
| JP56045907A |