To provide a resin composition for sealing electrical and electronic parts which has little risk of gelating even if retained at high temperature, is excellent in initial adhesion strength to aluminum materials, and is excellent in durability against an environmental load such as cold/hot cycle load, and to provide sealed electrical and electronic parts using the same.

The resin composition for sealing electrical and electronic parts contains a crystalline polyester resin (A) with polyether diol copolymerized therein, an epoxy resin (B) and a fluororesin (C), and has a melt viscosity of 5-3,000 dPa s when the resin composition is dried to a moisture content of 0.1% or less and heated to 220°C, and a pressure of 1 MPa is imparted to the resin composition, and when the resin composition is extruded with a die of a hole diameter of 1.0 mm and thickness of 10 mm.