Title:
電気電子部品封止用樹脂組成物、電気電子部品の製造方法および電気電子部品封止体
Document Type and Number:
Japanese Patent JP5077502
Kind Code:
B2
Abstract:
It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220°C, subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.
Inventors:
Daiki Funaoka
Kenji Shiga
Kenji Shiga
Application Number:
JP2012510462A
Publication Date:
November 21, 2012
Filing Date:
February 21, 2012
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA
International Classes:
C09K3/10; C08G63/66; C08L23/02; C08L61/06; C08L65/00; C08L67/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2010150471A | 2010-07-08 | |||
| JPH05175371A | 1993-07-13 | |||
| JPH01236268A | 1989-09-21 | |||
| JP2000178420A | 2000-06-27 |