Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION FOR SEALING AND MULTILAYERED GLASS STRUCTURE USING THE SAME
Document Type and Number:
Japanese Patent JP2007154129
Kind Code:
A
Abstract:

To provide a resin composition for sealing which can seal the space between the peripheral parts of substrates so that outside air and steam may not penetrate into the space even when exposed to a daylight and a sealing gas such as an inert gas does not leak from the inner space, and to provide a multilayered glass structure using the same.

The resin composition for sealing is used for forming a multilayered glass structure whose internal space is maintained under reduced pressure or in an inert gas atmosphere by sealing the space between the substrate peripheral parts of two substrates facing each other while retaining a predetermined interval. The resin composition for sealing comprises at least one kind of a thermoplastic resin (a) having a melting point of 160°C or higher, and at least one kind of an agent (c) for imparting ultraviolet radiation resistance selected from carbon black, an ultraviolet absorber, or a hindered amine-based light stabilizer that are incorporated in an amount sufficient to give ultraviolet radiation resistance, wherein the resin layer obtained by sealing forms a single-layer structure.


Inventors:
YOSHIZAWA SHOICHI
ISA JUNICHI
KATAOKA KYOKO
Application Number:
JP2005354793A
Publication Date:
June 21, 2007
Filing Date:
December 08, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C09K3/10; B60J1/00; C03C27/06; C08K3/04; C08K5/00; C08K9/06; C08L67/02; C08L77/00; C08L101/12; C09C1/00; C09C3/12; E06B3/64
Attorney, Agent or Firm:
Kenji Kawabi