Title:
RESIN COMPOSITION FOR SEALING AND SEALED ELECTRONIC PART DEVICE
Document Type and Number:
Japanese Patent JP3880598
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for sealing which is excellent in reflow resistance and molding curability and exhibits excellent flame retardancy without using a halogen-containing flame-retardant, and a sealed electronic part device using the same.
SOLUTION: The resin composition for sealing comprises (A) an epoxy resin comprising a biphenyl novolak type epoxy resin represented by general formula (1) (wherein n is an integer of at least 0), (B) a phenolic resin-based curing agent comprising a phenolic compound represented by general formula (2) (wherein R1-R4 are each a hydrogen atom or a methyl group), (C) at least one selected from among 1,5-diazabicyclo[4.3.0]nonene-5 and phenolic resin salts thereof, and (D) an inorganic filler. The sealed electronic part device is obtained by sealing an electronic part with a cured product thereof.
Inventors:
Isao Ichikawa
Takeru Uchida
Takeru Uchida
Application Number:
JP2004311339A
Publication Date:
February 14, 2007
Filing Date:
October 26, 2004
Export Citation:
Assignee:
Kyocera Chemical Co., Ltd.
International Classes:
C08G59/20; C08G59/62; C08G59/68; H01L23/29; H01L23/31
Domestic Patent References:
| JP2004203911A | ||||
| JP2004203910A | ||||
| JP2003327663A | ||||
| JP2004244601A | ||||
| JP2004131591A | ||||
| JP9169833A | ||||
| JP2001279057A | ||||
| JP3277620A |
Attorney, Agent or Firm:
Saichi Suyama
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