Title:
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015093896
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor having excellent colorability, shielding properties, laser marking characteristics and moldability without causing deterioration in electrical properties even in the case of a semiconductor device in which the pitch distance between solder balls and the like is small, and to provide a semiconductor device.SOLUTION: There is provided a resin composition for sealing a semiconductor which comprises a thermosetting resin, a curing agent, a curing accelerator, an inorganic filler and a coloring agent as essential components, where the coloring agent is a black titanium oxide powder subjected to surface treatment with SiO, the primary particle diameter is 100 nm or less and the electrical specific resistance is 10Ω.cm or more.
Inventors:
SATA CHIKA
Application Number:
JP2013232896A
Publication Date:
May 18, 2015
Filing Date:
November 11, 2013
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C08L101/02; C08K9/02; C08L61/06; C08L63/00; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2007161990A | 2007-06-28 | |||
| JP2001083315A | 2001-03-30 | |||
| JP2002107922A | 2002-04-10 |
Attorney, Agent or Firm:
Toshio Nishizawa