Title:
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP3230772
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition useful for sealing and coating electric parts, having excellent solder stress resistance and moisture resistance, comprising a specific epoxy resin, a curing agent consisting essentially of a phenol resin and a specific amount of an inorganic filler.
CONSTITUTION: This resin composition comprises (A) an epoxy resin containing 30-100wt.% of a biphenyl type epoxy structure of formula I (R1 to R4 are H or CH3) based on the total amount of the epoxy resin, (B) a curing agent containing 50-100wt.% phenol resin of formula II (X is p-xylylene; (n) is 1-8) based on the total amount of the curing agent and 70-90wt.% inorganic filler (preferably fused silica powder).
Inventors:
Akihiro Hirata
Application Number:
JP34307492A
Publication Date:
November 19, 2001
Filing Date:
December 24, 1992
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/22; C08G59/20; C08G59/24; C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08G59/24; C08K3/00; C08L63/00
Domestic Patent References:
| JP4225019A | ||||
| JP5206327A | ||||
| JP5343570A | ||||
| JP6107768A |