RESIN COMPOSITION FOR SEALING - TOSHIBA CHEM PROD

Title:

RESIN COMPOSITION FOR SEALING

Document Type and Number:

Japanese Patent JPS60112816

Kind Code:

A

Abstract:

PURPOSE: The titled composition having improved heat resistance and water- vapor resistance, low stress, and high relieability, containing a spiro ortho ester resin, a novolak phenolic resin, an epoxy resin, and a specific amount of inorganic filler.

CONSTITUTION: (A) A spiro ortho ester resin (e.g., compound shown by the formula) is blended with (B) a novolak phenolic resin, (C) an epoxy resin (having two or more epoxy groups in the molecule, such as cresol novolak epoxy resin, etc.), (D) 25W90wt% inorganic filler (preferably silica powder and alumina), and, if necessary, (E) an addition agent such as natural wax, etc., to give the desired composition. A molar ratio of epoxy group in the component C: phenolic hydroxyl group in the component B is preferably (0.1W10):1.

Inventors:

NAGATA TSUTOMU
KOUCHIYAMA MASAYUKI
HOSOKAWA HIROYUKI

Application Number:

JP21935383A

Publication Date:

June 19, 1985

Filing Date:

November 24, 1983

Export Citation:

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