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Title:
RESIN COMPOSITION FOR SEAMLESS BELT, AND SEAMLESS BELT
Document Type and Number:
Japanese Patent JP2006137937
Kind Code:
A
Abstract:

To provide a seamless belt exhibiting excellent durability, heat resistance and surface smoothness and stable electric resistance properties which is used for a photosensitive belt, an electrifying belt, a transferring belt, a fixing belt or the like in an image-forming device such as an electrophotographic copying machine or a laser printer, and a resin composition therefor.

The resin composition for seamless belts comprises a heat-resistant resin having a glass transition temperature of 100°C or higher and/or a melting point of 200°C or higher and 1-30 pts.mass, based on 100 pts.mass of the heat-resistant resin, of a gas phase method-carbon fiber having an average fiber diameter of 50-130 nm, and has volume resistivity value within the range from 1×106 to 1×1013 Ωcm. The seamless belt is obtained by molding the composition.


Inventors:
NAGAO TAKESHI
YAMAMOTO TATSUYUKI
Application Number:
JP2005297402A
Publication Date:
June 01, 2006
Filing Date:
October 12, 2005
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L101/12; B29D29/00; C08K7/06; C08L27/12; C08L71/10; C08L79/08; G03G15/00; G03G15/16; G03G15/20; G03G15/24
Domestic Patent References:
JP2003246927A2003-09-05
JP2004123867A2004-04-22
JPS63286468A1988-11-24
JP2004221071A2004-08-05
JP2004191554A2004-07-08
Foreign References:
WO2006041186A12006-04-20
Attorney, Agent or Firm:
Kunihisa Landlord
Nobuhiko Ozawa
Atsushi Hayashi



 
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