To provide a resin composition capable of producing a printed circuit board satisfying excellent laminate performances such as flame retardance and high heat resistance under conditions corresponding to lead-free solder, low heat expansion property and high metal foil-peeling strength while having good dielectric characteristics and low transmission loss in a high-frequency band.
The present invention relates to a resin composition containing a uncured semi-IPN type composite obtained by compatibilizing a prepolymer formed from (A) polyphenylene ether, (B) a chemically unmodified butadiene polymer containing ≥40% 1,2-butadiene unit having 1,2-vinyl group on the side chain in the molecule and (C) a crosslinking agent and (D) a bromine-based flame retardant having ≥300°C 5% mass-reducing temperature and not having reactivity with the component A, the component B, the component C and the uncured semi-IPN type composite, and a resin varnish, prepreg and a metal-clad laminate each using the resin composition.
COPYRIGHT: (C)2008,JPO&INPIT
FUJIMOTO DAISUKE
DANSEIGEN KAZUTOSHI
MURAI AKIRA
| JPS56133355A | 1981-10-19 | |||
| JPS58164638A | 1983-09-29 | |||
| JPS58164639A | 1983-09-29 | |||
| JPS63159443A | 1988-07-02 | |||
| JPH06179734A | 1994-06-28 | |||
| JPS57185350A | 1982-11-15 | |||
| JPS59193929A | 1984-11-02 | |||
| JPH03275760A | 1991-12-06 | |||
| JPS56133355A | 1981-10-19 | |||
| JPS58164638A | 1983-09-29 | |||
| JPS58164639A | 1983-09-29 | |||
| JPS63159443A | 1988-07-02 | |||
| JPH06179734A | 1994-06-28 | |||
| JPH07292126A | 1995-11-07 | |||
| JPH09290481A | 1997-11-11 | |||
| JP2008095061A | 2008-04-24 | |||
| JP2008291214A | 2008-12-04 | |||
| JP2008291227A | 2008-12-04 |
| WO2004067634A1 | 2004-08-12 | |||
| WO2004067634A1 | 2004-08-12 |
Koshiro Tsukuda
Fusayuki Saito