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Title:
RESIN COMPOSITION OF SEMI-IPN TYPE COMPOSITE AND VARNISH, PREPREG AND METAL-CLAD LAMINATE EACH USING THE SAME COMPOSITION
Document Type and Number:
Japanese Patent JP2007302876
Kind Code:
A
Abstract:

To provide a resin composition capable of producing a printed circuit board satisfying excellent laminate performances such as flame retardance and high heat resistance under conditions corresponding to lead-free solder, low heat expansion property and high metal foil-peeling strength while having good dielectric characteristics and low transmission loss in a high-frequency band.

The present invention relates to a resin composition containing a uncured semi-IPN type composite obtained by compatibilizing a prepolymer formed from (A) polyphenylene ether, (B) a chemically unmodified butadiene polymer containing ≥40% 1,2-butadiene unit having 1,2-vinyl group on the side chain in the molecule and (C) a crosslinking agent and (D) a bromine-based flame retardant having ≥300°C 5% mass-reducing temperature and not having reactivity with the component A, the component B, the component C and the uncured semi-IPN type composite, and a resin varnish, prepreg and a metal-clad laminate each using the resin composition.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
MIZUNO YASUYUKI
FUJIMOTO DAISUKE
DANSEIGEN KAZUTOSHI
MURAI AKIRA
Application Number:
JP2007098606A
Publication Date:
November 22, 2007
Filing Date:
April 04, 2007
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L47/00; B32B15/08; C08G81/02; C08J5/24; C08L71/12; C09D5/18; C09D109/00; C09D147/00; C09D171/10; C09D179/04; H05K1/03
Domestic Patent References:
JPS56133355A1981-10-19
JPS58164638A1983-09-29
JPS58164639A1983-09-29
JPS63159443A1988-07-02
JPH06179734A1994-06-28
JPS57185350A1982-11-15
JPS59193929A1984-11-02
JPH03275760A1991-12-06
JPS56133355A1981-10-19
JPS58164638A1983-09-29
JPS58164639A1983-09-29
JPS63159443A1988-07-02
JPH06179734A1994-06-28
JPH07292126A1995-11-07
JPH09290481A1997-11-11
JP2008095061A2008-04-24
JP2008291214A2008-12-04
JP2008291227A2008-12-04
Foreign References:
WO2004067634A12004-08-12
WO2004067634A12004-08-12
Attorney, Agent or Firm:
津国 肇
束田 幸四郎
齋藤 房幸