Title:
樹脂組成物及び樹脂組成物を使用して作製した半導体装置
Document Type and Number:
Japanese Patent JP4972853
Kind Code:
B2
Inventors:
Mitsuru Okubo
Application Number:
JP2004146201A
Publication Date:
July 11, 2012
Filing Date:
May 17, 2004
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K3/08; H01L21/52; C08L79/08; C09J179/08; H01L23/373
Domestic Patent References:
| JP6329795A | ||||
| JP2002097270A | ||||
| JP2003347321A | ||||
| JP6232189A | ||||
| JP59045355A | ||||
| JP6102667A |