Title:
樹脂組成物及び樹脂組成物を使用して作製した半導体装置
Document Type and Number:
Japanese Patent JP5751497
Kind Code:
B2
Abstract:
A resin composition of the present invention includes a maleimide derivative (A) represented by a general formula (1) and a bis-maleimide compound (B) represented by a general formula (2). In the general formula (1), R1 represents a straight chain or branched alkylene group having 1 or more carbon atoms, R2 represents a straight chain or branched alkyl group having 5 or more carbon atoms, and the sum of carbon atoms of R1 and R2 is 10 or less. In the general formula (2), X1 represents -O-, -COO-, or -OCOO-, R3 represents a straight chain or branched alkylene group having 1 to 5 carbon atoms, R4 represents a straight chain or branched alkylene group having 3 to 6 carbon atoms, and m is an integer of 1 or more and 50 or less.
Inventors:
Takashi Kawana
Naoya Kanamori
Ryuichi Murayama
Naoya Kanamori
Ryuichi Murayama
Application Number:
JP2012533009A
Publication Date:
July 22, 2015
Filing Date:
September 07, 2011
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08F222/40; C08F218/16; C08F290/06; C08K3/00; C08L35/00; H01L21/52
Domestic Patent References:
| JP2007238680A | 2007-09-20 | |||
| JPH0855940A | 1996-02-27 | |||
| JP2001322976A | 2001-11-20 |
Foreign References:
| WO2005090510A1 | 2005-09-29 | |||
| WO2000010974A2 | 2000-03-02 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Masatake Shiga