RESIN COMPOSITION, SEMICONDUCTOR DEVICE, MULTILAYER CIRCUIT BOARD AND ELECTRONIC COMPONENT

Title:

RESIN COMPOSITION, SEMICONDUCTOR DEVICE, MULTILAYER CIRCUIT BOARD AND ELECTRONIC COMPONENT

Document Type and Number:

Japanese Patent JP2012156385

Kind Code:

A

Abstract:

To provide a resin composition having a flux function not damaged by heating, and capable of electrically connecting a semiconductor chip, or the like, and a circuit board well, and to provide a semiconductor device, a multilayer circuit board and an electronic component using such a resin composition.

The resin composition composing a resin composition layer having a flux function used in the solder joint surface of a first member contains a resin capable of crosslinking reaction, and a thermal acid generating agent which generates an acid by heating. Preferably, the thermal acid generating agent is one kind selected from a group consisting of an onium salt compound, a triazine derivative, an organic sulfonic acid condensed derivative, and an organic carboxylic acid condensed derivative.

Inventors:

MOCHIZUKI SHUNSUKE
MAEJIMA KENZO
KATSURAYAMA SATORU
HAYASHI NOBUAKI

Application Number:

JP2011015459A

Publication Date:

August 16, 2012

Filing Date:

January 27, 2011

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO

International Classes:

H01L21/60

Domestic Patent References:

JP2012025814A	2012-02-09
JP2009013308A	2009-01-22
JP2008085264A	2008-04-10
JP2009286824A	2009-12-10
JP2003297556A	2003-10-17

Foreign References:

WO2009081874A1

2009-07-02

Attorney, Agent or Firm:

Tatsuya Masuda
Kazuo Asahi

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