Title:
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2007238680
Kind Code:
A
Abstract:
To provide a resin composition having excellent adhesive strength, fast curing property and moisture resistance and provide a semiconductor device having excellent soldering crack resistance and high reliability by using the resin composition as a die attach material for semiconductor.
The resin composition comprises (A) a bismaleimide compound having a polyalkylene oxide skeleton, (B) an allyl ester compound having a polyalkylene oxide skeleton, (C) a (meth)acrylate having hydroxycarbonyl group, (D) a (meth)acrylate having hydroxyl group, (E) a radical initiator and (F) a filler.
COPYRIGHT: (C)2007,JPO&INPIT
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Inventors:
MURAYAMA RYUICHI
Application Number:
JP2006060119A
Publication Date:
September 20, 2007
Filing Date:
March 06, 2006
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F299/00; C09J4/00; C09J11/04; C09J11/06; H01L21/52
Domestic Patent References:
| JP2002121221A | 2002-04-23 | |||
| JP2006028265A | 2006-02-02 | |||
| JP2002121221A | 2002-04-23 | |||
| JP2006028265A | 2006-02-02 |
Foreign References:
| WO2005090510A1 | 2005-09-29 | |||
| WO2005090510A1 | 2005-09-29 |