RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME

Japanese Patent JP2001323174

A

To provide a resin composition that can give a resin coating film having high strength and having excellent flexibility and excellent heat resistance in a single step of drying a solvent, not accompanied with an imidization step and provide a good semiconductor device using the resin composition.

The resin composition comprises a resin (A) and a resin (B) as given below and an organic solvent: (A) an aromatic thermoplastic resin that is soluble in a polar solvent at room temperature and (B) an aromatic thermoplastic resin that is insoluble in a polar solvent at room temperature but is soluble therein by heating.

JPH02163122	THERMOPLASTIC ELASTOMER AND ARTICLE MADE OF THE SAME
JPH0618887	INDUSTRIAL APPLICABILITY The polyphenylene ether-polyamide copolymer produced from the polyphenylene ether capped with epoxy triazine.
JPH07138365	PRODUCT OF BLOW MOLDING

YANO YASUHIRO
MATSUURA SHUICHI
NOMURA YOSHIHIRO

JP2000224762A

November 20, 2001

July 26, 2000

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HITACHI CHEMICAL CO LTD

C08G69/40; C08G69/42; C08G73/10; C08K9/04; C08L21/00; C08L77/00; C08L79/08; C08L101/12; (IPC1-7): C08L101/12; C08G69/40; C08G69/42; C08G73/10; C08K9/04; C08L21/00; C08L77/00; C08L79/08

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