Title:
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2010077363
Kind Code:
A
Abstract:
To provide a resin composition that has excellent thickness accuracy, height uniformity, and gap-filling performance, and a semiconductor device with excellent flatness produced using the resin composition.
The resin composition including (A) a cyclic olefin polymer or a hydrogenated product thereof and (B) an oxetane compound, and the semiconductor device produced using the resin composition are provided. Preferably, the oxetane compound (B) has a structure represented by general formula (1).
Inventors:
OHASHI SEIJI
TAKEUCHI ETSU
TAKEUCHI ETSU
Application Number:
JP2008250586A
Publication Date:
April 08, 2010
Filing Date:
September 29, 2008
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/20; C08G65/18; H01L23/06; H01L23/29; H01L23/31
Domestic Patent References:
JP2007177073A | 2007-07-12 | |||
JP5040432B2 | 2012-10-03 |
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