Title:
RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015025121
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor encapsulation, from which a semiconductor encapsulating material excellent in heat resistance can be formed, and to provide a semiconductor device having excellent reliability, manufactured by encapsulating a semiconductor element with a cured product of the above resin composition for semiconductor encapsulation.SOLUTION: The resin composition for semiconductor encapsulation comprises a polymaleimide compound, at least one of two kinds of difunctional benzoxazine compounds, a curing catalyst, and an inorganic filler. When a compounding ratio of the polymaleimide compound to the difunctional benzoxazine compound is represented by 1:M in terms of an equivalent ratio, M is less than 0.2.
Inventors:
OZAKI YUI
YAMASHITA KATSUSHI
KASHINO TOMOMASA
YAMASHITA KATSUSHI
KASHINO TOMOMASA
Application Number:
JP2014122121A
Publication Date:
February 05, 2015
Filing Date:
June 13, 2014
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G14/073; C08L39/04; C08L61/20
Domestic Patent References:
| JP2012097206A | 2012-05-24 | |||
| JPH10259248A | 1998-09-29 | |||
| JP2015025120A | 2015-02-05 |
Foreign References:
| WO2014203781A1 | 2014-12-24 | |||
| WO2014057973A1 | 2014-04-17 |
Other References:
TSUTOMU TAKEICHI: "High-performance polymer alloys of polybenzoxazine and bismaleimide", POLYMER, vol. 49, JPN7014001075, 2008, JP, pages 1173 - 1179, ISSN: 0003755628